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Ulwazi malunga nomzi mveliso ngokuhamba kwakhona komngxunya kunye nokuthelekisa ukujikeleza kwe-wave

I-through-hole reflow soldering, ngamanye amaxesha ekubhekiswa kuyo njenge-soldering yokugcwalisa izinto ezihleliweyo, iyenyuka. Inkqubo yokufaka umngxunya wokuhlaziya kukusebenzisa itekhnoloji ye-soldering teknoloji ukujija izinto ze-plug-in kunye nezinto ezinemilo ekhethekileyo enezikhonkwane. Kwezinye iimveliso ezinje ngamacandelo e-SMT kunye nezinto ezenziwe ngeplastikhi (izinto ze-plug-in) ezingaphantsi, le nkqubo yokuhamba inokuthi ithathe indawo ye-wave soldering, kwaye ibe yitekhnoloji yendibano ye-PCB kwikhonkco lenkqubo. Olona thuba lubalaseleyo lokufaka ngaphakathi umngxunya wokufaka i-soldering kukuba iplagi enemingxunya inokusetyenziselwa ukufumana amandla angcono oomatshini ngelixa usebenzisa i-SMT.

Izinto eziluncedo ze ngokusebenzisa-umngxunya reflow ngelotha xa kuthelekiswa ngelotha yomtshangatshangiso

 

Umgangatho we-through-hole reflow soldering ulungile, umlinganiso ombi we-PPM ungangaphantsi kwe-20.

2.Iziphene ze-solder kunye kunye ne-solder edibeneyo zimbalwa, kwaye izinga lokulungisa liphantsi kakhulu.

Uyilo loyilo lwe-3.PCB aludingi kuthathelwa ingqalelo ngendlela efanayo ne-soldering wave.

Inkqubo yokuhamba okulula, ukusebenza kwezixhobo ezilula.

I-5.Izixhobo zokuvula umngxuma ezihlala ngaphakathi zihlala kwindawo encinci, kuba umatshini wokushicilela kunye nesithando somlilo esincinci zincinci, ke yindawo encinci kuphela.

6. Ingxaki ye-Wuxi slag.

7.Umatshini ufakwe ngokupheleleyo, ucocekile, kwaye unuka simahla kumasifundisane.

Ukulawulwa kwezixhobo zokuhlaziya kunye nokugcina izixhobo kulula.

Inkqubo yokuprinta isebenzise itemplate yokushicilela, indawo nganye yokuwelda kunye nenani lokuprinta elinokulungelelanisa ngokwemfuno.

10.Kwinto reflow, ukusetyenziswa template ekhethekileyo, indawo iwelding lobushushu kuhlengahlengiswe njengoko kufuneka.

Iingxaki zokungena kwe-hole-soldering soldering xa kuthelekiswa ne-soldering wave:

Iindleko ze-hole-solder reflow soldering ziphezulu kunezo zokutshiza i-soldering ngenxa yokunamathisela i-solder.

Inkqubo yokuvula umngxunya kufuneka ibe yitemplate ekhethekileyo, ebiza kakhulu. Kwaye imveliso nganye ifuna iseti yayo yokushicilela itemplate kunye nokugcwalisa kwakhona itemplate.

I-3 ngokusebenzisa umngxunya wokufudumeza iziko kunokonakalisa izinto ezinganyangekiyo bubushushu.

Ekukhetheni izinto, ingqalelo ekhethekileyo kwizinto zeplastiki, ezinje ngeepotometerom kunye nomnye umonakalo onokwenzeka ngenxa yeqondo lobushushu eliphezulu. Ngokwazisa nge-hole-reflow soldering, i-Atom iphuhlise inani lezihlanganisi (uthotho lwe-USB, uthotho lwe-Wafer ... njl.


Ixesha Post: Jun-09-2021