I-solder ye-reflow solder, ngamanye amaxesha ebizwa ngokuba yi-reflow soldering yamacandelo ahleliweyo, iyanda.Ukutyhubela umngxuma wokuphinda kufakwe i-solder kukusebenzisa itekhnoloji ye-reflow soldering ukuwelda amacandelo eplagi kunye nezinto ezinokwakheka okukhethekileyo ngezikhonkwane.Kwezinye iimveliso ezinje ngamacandelo e-SMT kunye namacandelo anemingxuma (i-plug-in components) ngaphantsi, le nkqubo ihamba ingathatha indawo ye-soldering ye-wave, kwaye ibe yi-teknoloji yendibano ye-PCB kwikhonkco lenkqubo.Olona ncedo lulungileyo lokuphinda umngxuma wokuphinda uqukunjelwe iplagi kukuba iplagi yokuphuma komngxuma ingasetyenziselwa ukufumana amandla angcono omatshini ngelixa uthatha ithuba le-SMT.

Izinto eziluncedo zokutyhutyha i-out-hole reflow soldering xa kuthelekiswa namaza e-solder

 

1.Umgangatho wokuphinda ujikeleze umngxuma ulungile, umlinganiselo ombi wePPM unokuba ngaphantsi kwe-20.

I-2.Iziphene ze-solder joint kunye ne-solder joint zimbalwa, kwaye izinga lokulungisa liphantsi kakhulu.

I-3.PCB uyilo loyilo akufuneki ukuba luthathelwe ingqalelo ngendlela efanayo ne-wave soldering.

I-4.inkqubo elula yokuhamba, ukusebenza kwezixhobo ezilula.

I-5.Isixhobo sokubuyisela i-hole-hole sithatha indawo encinci, kuba umatshini wayo wokushicilela kunye ne-reflow furnace zincinci, ngoko ke indawo encinci kuphela.

6.Ingxaki yeWuxi slag.

7.Umatshini uvalelwe ngokupheleleyo, ucocekile, kwaye awunavumba kwindawo yokusebenzela.

I-8.Ngolawulo lwezixhobo zokuphinda ziqhutyelwe kunye nokugcinwa kulula.

9.Inkqubo yokuprinta isebenzise itemplate yokuprinta, indawo nganye ye-welding kunye nobuninzi be-paste yokuprinta inokuhlengahlengisa ngokwemfuno.

10.Kwi-reflow, ukusetyenziswa kwetemplate ekhethekileyo, indawo ye-welding yeqondo lokushisa inokulungiswa njengoko kufuneka.

Izinto ezingeloncedo ngokuphinda-phinda umngxuma xa kuthelekiswa nokuphinda kuvele amaza:

I-1.Ixabiso le-solder ye-hole reflow iphezulu kune-solder ye-wave solder ngenxa ye-solder paste.

I-2.through-hole reflow process kufuneka yenziwe ngokwezifiso itemplate ekhethekileyo, ibiza kakhulu.Kwaye imveliso nganye idinga iseti yayo yoshicilelo lwetemplate kunye nethempleyithi yokuphinda igalele kwakhona.

3.Iziko lokuqukuqela kwakhona komngxuma lingonakalisa amacandelo angaxhathisi ubushushu.

Ekukhethweni kwamacandelo, ingqalelo ekhethekileyo kumacandelo eplastiki, njenge-potentiometers kunye nolunye umonakalo onokwenzeka ngenxa yokushisa okuphezulu.Ngokungeniswa kwe-soldering ye-hole reflow soldering, i-Atom iphuhlise inani lokudibanisa (uchungechunge lwe-USB, uchungechunge lwe-Wafer ... njl.